Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound

An epoxy resin compound comprising:

• an epoxy resin;
• a hardening agent;
• and
• an inorganic filler,
• wherein the epoxy resin comprises an epoxy resin represented by the following Chemical Formula 1:
• wherein n is from 1 to 3, m is from 1 to 3, R1 represents one to three aryl groups, R2 represents one to three aryl groups, and R3, R4, R5, R6, R7 and R8 are independently selected from the group consisting of hydrogen, an alkyl group having 1 to 30 carbon atoms, a halogen, an aryl group, an alkoxy group, an amino group, a hetero aryl group, and a carboxylic group, and
• wherein at least one of R7 and R8 is a halogen.