Semiconductor device and method of manufacturing semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHidekazu Takahashi, Daiki Yamada, Yohei Monma, Hiroki Adachi, Shunpei Yamazaki
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Abstract
A semiconductor element is formed on a first surface of the substrate. A resin layer is formed over a second surface of the substrate which is opposite to the first surface of the substrate and on a part of the side surface of the substrate. A step is formed on the side surface of the substrate. The width of the upper section of the substrate with a step is narrower than the lower section of the substrate with a step. Therefore, the substrate can also be a protrusion.
Claims13
A method for manufacturing a semiconductor device, comprising:
- forming a semiconductor element including a transistor including a gate electrode and a semiconductor film on a first surface of a glass substrate;
- thinning the substrate from a second surface side opposite to the first surface to form a thinned substrate having a third surface opposite to the first surface;
- forming a first groove on the third surface side and in the thinned substrate;
- forming a first resin layer over the third surface and the first groove, wherein a second groove of the first resin layer is provided in the first groove;
- and
- dividing the thinned substrate,
- wherein a bottom surface of the second groove is provided over a bottom surface of the first groove,
- wherein a side surface of the divided substrate in a cross-section has a first side surface which is covered with the first resin layer and a second side surface which is exposed, and
- wherein the first side surface is curved.
A method for manufacturing a semiconductor device, comprising:
- forming a semiconductor element including a transistor including a gate electrode and a semiconductor film on a first surface of a glass substrate;
- forming a first groove on a second surface side of the substrate opposite to the first surface and in the substrate;
- forming a first resin layer over the second surface and the first groove, wherein a second groove of the first resin layer is provided in the first groove;
- and
- dividing the substrate,
- wherein a bottom surface of the second groove is provided over a bottom surface of the first groove,
- wherein a side surface of the divided substrate in a cross-section has a first side surface which is covered with the first resin layer and a second side surface which is exposed, and
- wherein the first side surface is curved.
Dependencies are inferred from the claim text.