Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

A wafer process body, wherein in the wafer process body, a temporary adhesive layer is formed on a supporting body and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is a composite temporary adhesive layer having a three-layered structure comprised of:

• a first temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable,
• a second temporary adhesive layer composed of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer, and
• a third temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A′) which is similar to the first temporary adhesive layer;
• the layer (A′) being stacked on the second temporary adhesive layer and adhered to the supporting body so as to be detachable.

A method for manufacturing a thin wafer comprising:

• (a) a step of grinding or polishing of the non-circuit-formed surface of the wafer in a wafer process body, wherein, in the wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is formed by:
• forming a first temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable, and
• forming a second temporary adhesive layer composed of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable,
• (b) a step of processing of the non-circuit-formed surface of the wafer, and
• (c) a step of detaching the processed wafer from the supporting body.

A method for manufacturing a thin wafer comprising:

• (a) a step of grinding or polishing of the non-circuit-formed surface of the wafer in a wafer process body, wherein, in the wafer process body, a temporary adhesive layer is formed on a supporting body and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is a composite temporary adhesive layer having a three-layered structure formed by:
• forming a first temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable,
• forming a second temporary adhesive layer composed of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer, and
• forming a third temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A′) which is similar to the first temporary adhesive layer;
• the layer (A′) being stacked on the second temporary adhesive layer and adhered to the supporting body so as to be detachable,
• (b) a step of processing of the non-circuit-formed surface of the wafer, and
• (c) a step of detaching the processed wafer from the supporting body.

A wafer processing member, wherein, in the wafer processing member, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is to be temporarily adhered to the temporary adhesive layer, wherein the temporary adhesive layer comprises:

• a third temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A′) which is adhered to the supporting body so as to be detachable,
• a second temporary adhesive layer composed of a thermosetting-modified siloxane polymer layer (B) which is stacked on the third temporary adhesive layer, and
• a first temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is similar to the third temporary adhesive layer and is stacked on the second adhesive layer;
• the layer (A) being capable of adhesion to and detachment from the front surface of the wafer.

A wafer processing temporary adhesive material, wherein the wafer processing temporary adhesive material is to temporarily bond a supporting body to a wafer which has a circuit formed front surface and a to-be-processed back surface, wherein the wafer processing temporary adhesive material comprises:

• a first temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is capable of adhesion to and detachment from the front surface of the wafer,
• a second temporary adhesive layer composed of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer, and
• a third temporary adhesive layer composed of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A′) which is similar to the first temporary adhesive layer and is stacked on the second temporary adhesive layer;
• the layer (A′) being capable of adhesion to and detachment from the supporting body.