Focal plane array and method for manufacturing the same

A method of forming a focal plane array comprising one or more pixels, the focal plane array being fabricated by:

• forming a first wafer having sensing material provided on a surface, which is covered by a first sacrificial layer, the sensing material defining one or more pixels on the first wafer;
• providing support legs for each of the one or more pixels within the first sacrificial layer, covering them with a further sacrificial layer and forming first conductive portions for each of the one or more pixels in the surface of the further sacrificial layer that are in contact with the respective support legs;
• forming a second wafer having a read-out integrated circuit (ROIC), the second wafer being covered by a second sacrificial layer, into which is formed second conductive portions for each of the one or more pixels in contact with the ROIC;
• bringing the first, second and further sacrificial layers of the formed first wafer and second wafer together such that the first and second conductive portions for each of the one or more pixels are aligned;
• bonding the aligned first and second conductive portions together to form conductive contact plugs;
• removing a sacrificial handle layer of the first wafer and thereby transferring the sensing material from the first wafer to the second wafer;
• and
• removing the first, second and further sacrificial layers to release the at least one pixel,
• wherein each of the support legs is a single component in direct physical contact with both the pixel and the conductive contact plugs, to provide an electrical connection between the pixel and the ROIC and is arranged to be completely beneath the sensing material of the pixel they are provided for.