Process of forming an electronic device including a vertical conductive structure
AssigneeSemiconductor Components Industries, LLC
InventorsGary H. Loechelt, Gordon M. Grivna
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AssigneeSemiconductor Components Industries, LLC
InventorsGary H. Loechelt, Gordon M. Grivna
Estimating the term…
An electronic device can include a buried conductive region and a semiconductor layer over the buried conductive region. The electronic device can further include a horizontally-oriented doped region and a vertical conductive region, wherein the vertical conductive region is electrically connected to the horizontally-oriented doped region and the buried conductive region. The electronic device can still further include an insulating layer overlying the horizontally-oriented doped region, and a first conductive electrode overlying the insulating layer and the horizontally-oriented doped region, wherein a portion of the vertical conductive region does not underlie the first conductive electrode. The electronic device can include a Schottky contact that allows for a Schottky diode to be connected in parallel with a transistor. Processes of forming an electronic device allow a vertical conductive region to be formed after a conductive electrode, a gate electrode, a source region, or both.
A process of forming an electronic device comprising:
A process of forming an electronic device comprising:
A process of forming an electronic device comprising:
Dependencies are inferred from the claim text.