Systems and methods providing semiconductor light emitters
AssigneeTSMC Solid State Lighting Ltd.
InventorsTien-Ming Lin, Chih-Hsuan Sun, Wei-Yu Yeh
Life of this patent
Estimating the term…
Abstract
A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
Claims20
A method for manufacturing a semiconductor structure, the method comprising:
- providing a wafer with a plurality of light-emitting diodes (LEDs) disposed thereon;
- providing a lens board having a plurality of microlenses;
- filling the microlenses with an optical glue;
- aligning the lens board with the wafer such that each microlens is aligned with a respective LED;
- and
- thereafter placing the lens board over the wafer so that the LEDs are housed within the microlenses, respectively, the optical glue being disposed between the LEDs and the microlenses.
A method for manufacturing a plurality of light-emitting diodes (LEDs), the method comprising:
- providing a wafer with a plurality of light-emitting diodes (LEDs) disposed thereon;
- providing a lens board having a plurality of microlenses;
- applying optical glue to the microlenses;
- aligning each microlens with a respective LED;
- and
- thereafter securing the lens board to the wafer in a manner such that each LED is covered by a respective microlens and the optical glue within the microlens, the optical glue providing an airtight seal for the LEDs;
- and
- thereafter dicing the wafer to singulate the LEDs.
A method for manufacturing a plurality of light-emitting diodes (LEDs), the method comprising:
- providing a wafer with a plurality of light-emitting diodes (LEDs) disposed thereon, the wafer containing a plurality of recessed channels adjacent to the LEDs;
- providing a lens board having a plurality of microlenses, the lens board having a plurality of via holes;
- applying optical glue to the microlenses;
- aligning each microlens with a respective LED;
- and
- thereafter attaching, via an adherent glue, the lens board to the wafer in a manner such that each LED is covered by a respective microlens, wherein the vias and the recessed channels are at least partially filled with excess optical glue and adherent glue during the attaching;
- and
- thereafter dicing the wafer to singulate the LEDs.
Dependencies are inferred from the claim text.