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US 8,999,762 B2Granted
Process for encapsulating a micro-device by attaching a cap and depositing getter through the cap
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsXavier Baillin, Jean-Louis Pornin
Life of this patent
Estimating the term…
Abstract
A process for encapsulating a micro-device in a cavity formed between a first and a second substrate is provided, including producing the micro-device in or on the first substrate; attaching and securing the second substrate to the first substrate, thereby forming the cavity in which the micro-device is placed; producing at least one hole through one of the two substrates, leading into the cavity opposite a portion of the other of the two substrates; depositing at least one getter material portion through the hole on said portion of the other of the two substrates; and hermetically sealing the cavity by closing the hole.
Claims16
A process for encapsulating a micro-device, comprising:
- producing the micro-device in or on at least one first substrate;
- attaching and securing at least one second substrate to the at least one first substrate, forming a cavity therebetween in which the micro-device is disposed;
- producing at least one hole through at least one of said at least one first substrate and said at least one second substrate, the at least one hole leading into the cavity opposite a portion of another of said at least one first substrate and said at least one second substrate;
- forming a relief by depositing at least one first material on said portion of the another of said at least one first substrate and said at least one second substrate, the relief having at least one sidewall;
- depositing at least one second material on said portion of the another of said at least one first substrate and said at least one second substrate through the at least one hole such that the deposited at least one second material does not obstruct the at least one hole,
- wherein the at least one second material is at least one getter material portion, and is deposited on at least a part of the at least one sidewall on said relief;
- and
- hermetically sealing the cavity by closing the at least one hole.
5 more elements
A process for encapsulating a micro-device, comprising:
- producing the micro-device in or on at least one first substrate;
- attaching and securing at least one second substrate to the at least one first substrate, forming a cavity therebetween in which the micro-device is disposed;
- producing at least one hole through at least one of said at least one first substrate and said at least one second substrate, the at least one hole leading into the cavity opposite a portion of another of said at least one first substrate and said at least one second substrate;
- forming a relief by depositing at least one first material on said portion of the another of said at least one first substrate and said at least one second substrate, the relief having at least one sidewall,
- wherein the at least one first material is also deposited on at least one wall of the at least one hole, thereby partially closing the at least one hole;
- depositing at least one second material on said portion of the another of said at least one first substrate and said at least one second substrate through the at least one hole such that the deposited at least one second material does not obstruct the at least one hole,
- wherein the at least one second material is at least one getter material portion, and is deposited on at least a part of the at least one sidewall on said relief;
- and
- hermetically sealing the cavity by closing the at least one hole.
6 more elements
A process for encapsulating a micro-device, comprising:
- producing the micro-device in or on at least one first substrate;
- attaching and securing at least one second substrate to the at least one first substrate, forming a cavity therebetween in which the micro-device is disposed;
- producing at least one hole through at least one of said at least one first substrate and said at least one second substrate, the at least one hole leading into the cavity opposite a portion of another of said at least one first substrate and said at least one second substrate;
- forming a relief by depositing at least one first material on said portion of the another of said at least one first substrate and said at least one second substrate,
- wherein the relief has at least one sidewall and at least one embossment having a section with a substantially triangular shape in a plane that is perpendicular to at least one main face of said portion of the another of said at least one first substrate and said at least one second substrate;
- depositing at least one second material on said portion of the another of said at least one first substrate and said at least one second substrate through the at least one hole such that the deposited at least one second material does not obstruct the at least one hole,
- wherein the at least one second material is at least one getter material portion, and is deposited on at least a part of the at least one sidewall on said relief;
- and
- hermetically sealing the cavity by closing the at least one hole.
6 more elements
Dependencies are inferred from the claim text.