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US 8,999,756 B2Granted
Method and apparatus for semiconductor device fabrication using a reconstituted wafer
AssigneeInfineon Technologies AG
InventorsHans-Joachim Barth, Matthias Hierlemann
Life of this patent
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Abstract
Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame.
Claims23
A method of fabricating a semiconductor device, the method comprising:
- providing chips comprising a first chip and a second chip;
- placing the chips in a frame having a plurality of openings, wherein the first and the second chips are placed in a same opening of the plurality of openings, wherein the first and the second chips in the opening are separated from another chip placed with an adjacent opening of the plurality of openings by a portion of the frame;
- forming a reconstituted wafer by filling a mold compound into the plurality of openings, the mold compound being formed around and between the first and the second chips;
- forming a finished die comprising the first and the second chips, wherein the first and the second chips are coupled together through a conductive layer;
- and
- separating the finished die from the frame.
3 more elements
A method of fabricating a semiconductor device, the method comprising:
- providing a reusable frame comprising a plurality of openings;
- placing a first chip and a second chip in an opening of the plurality of openings, wherein the first chip and the second chip in the opening are separated from another chip placed with an adjacent opening of the plurality of openings by a portion of the reusable frame;
- filling a mold compound into the plurality of openings, the mold compound being formed around and between the first and the second chips;
- forming a finished die comprising the first and the second chips;
- and
- separating the finished die from the frame while keeping the frame intact.
3 more elements
A frame comprising:
- a cylindrical silicon substrate having a diameter of at least 200 mm;
- and
- a plurality of openings disposed within the silicon substrate, wherein the plurality of openings has tapered sidewalls, wherein the plurality of openings are arranged in a plurality of rows and columns, wherein a number of openings along a row has a maximum for a central row aligned along the diameter, wherein each of the plurality of openings is separated by a portion of the frame, wherein all the plurality of openings have about the same shape and size.
A method of fabricating a semiconductor device, the method comprising:
- providing chips comprising a first chip and a second chip;
- placing the chips in a frame having a plurality of openings, wherein the first and the second chips are placed in a same opening of the plurality of openings, wherein the frame comprises a bottom surface and an opposite top surface, wherein the plurality of openings has tapered sidewalls, wherein a diameter of a particular opening of the plurality of openings at the bottom surface is different from a diameter of that particular opening at the top surface;
- forming a reconstituted wafer by filling a mold compound into the plurality of openings, the mold compound being formed around and between the first and the second chips;
- forming a finished die comprising the first and the second chips, wherein the first and the second chips are coupled together through a conductive layer;
- and
- separating the finished die from the frame.
3 more elements
A method of fabricating a semiconductor device, the method comprising:
- providing a reusable frame comprising a plurality of openings, wherein the plurality of openings has tapered sidewalls, wherein the reusable frame comprises a bottom surface and an opposite top surface, and wherein a diameter of a particular opening of the plurality of openings at the bottom surface is different from a diameter of that particular opening at the top surface;
- placing a first chip and a second chip in an opening of the plurality of openings;
- filling a mold compound into the plurality of openings, the mold compound being formed around and between the first and the second chips;
- forming a finished die comprising the first and the second chips;
- and
- separating the finished die from the frame while keeping the frame intact.
3 more elements
Dependencies are inferred from the claim text.