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US 8,999,754 B2Granted
Integrated circuit package with molded cavity
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Il Kwon Shim, Byung Joon Han
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer.
Claims22
A method of manufacture of an integrated circuit package system comprising:
- providing a base substrate;
- attaching a base die over the base substrate;
- attaching an integrated interposer having interposer circuit devices, over the base die;
- electrically connecting base package connectors between the base die and the integrated interposer;
- and
- forming a package system encapsulant having an encapsulant cavity over the integrated interposer.
3 more elements
A method of manufacture of an integrated circuit package system comprising:
- providing a base substrate having base inner connections and base outer connections;
- mounting a base die over the base inner connections;
- mounting an integrated interposer having interposer circuit devices, interposer inner connections, and interposer outer connections, over the base die;
- electrically connecting base package connectors between the base die and the integrated interposer;
- molding a package system encapsulant having an encapsulant cavity over the interposer outer connections;
- and
- mounting a top package over the interposer outer connections.
4 more elements
An integrated circuit package system comprising:
- a base substrate;
- a base die over the base substrate;
- an integrated interposer having interposer circuit devices, over the base die;
- base package connectors electrically connected between the base die and the intergrated interposer;
- and
- a package system encapsulant having an encapsulant cavity over the integrated interposer.
3 more elements
Dependencies are inferred from the claim text.