Semiconductor packaging identifier
AssigneeCypress Semiconductor Corporation
InventorBo Soon Chang
Life of this patent
Estimating the term…
Abstract
An embodiment of the present invention is directed to a semiconductor packaging frame allowing identification information to be stored in the paddle area of the individual frame. Forming identification information on the paddle allows unique tracking of the semiconductor frame package during and after manufacturing and for tracking down variances, defects, and other problems during the semiconductor packaging process. Further, the shapes formed from the identification information provide increased surface area for bonding of the molding compound and thus strengthen the bond between the die paddle and molding compound thereby improving the strength of the semiconductor package.
Claims20
A method for forming a semiconductor package frame comprising:
- forming a plurality of openings for wires in a material;
- receiving identification information;
- and
- forming a plurality of markings within a paddle area of said material based on said identification information, wherein the paddle area comprises a die-mounting surface for mounting a die, wherein said identification information uniquely identifies said material from among a plurality of other lead frames, each of the plurality of other lead frames comprising identification information unique to each of the respective plurality of other lead frames.
A lead frame comprising:
- a plurality of openings;
- a plurality of conductive fingers between said plurality of openings;
- and
- a paddle area coupled to said plurality of fingers, wherein the paddle area comprises a die-mounting surface for mounting a die, wherein included within said die-mounting surface is a plurality of markings comprising identification information unique to said lead frame to uniquely identify said lead frame from among a plurality of other lead frames, each of the plurality of other lead frames comprising identification information unique to each of the respective plurality of other lead frames.
An integrated circuit package, comprising:
- a plurality of pins operable to couple to a circuit board;
- a die comprising an integrated circuit;
- a plurality of wires operable to couple said die with said plurality of pins;
- a lead frame comprising a paddle area for mounting said die and wherein included within said paddle area is a plurality of markings comprising identification information unique to said lead frame to uniquely identify said lead frame from among a plurality of other lead frames, each of the plurality of other lead frames comprising identification information unique to each of the respective plurality of other lead frames.
Dependencies are inferred from the claim text.