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US 8,999,745 B2Granted
Phase-change memory device and fabrication method thereof
AssigneeSK hynix Inc.
InventorIl Yong Lee
Life of this patent
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Abstract
A phase-change memory device and a method of fabricating the same are provided. The phase-change memory device includes a semiconductor substrate in which a word line is arranged, a diode line disposed over the word line and extending parallel to the word line, a phase-change line pattern disposed over the diode line, and a projection disposed between the diode line and the phase-change line pattern and protruding from the diode line. The diode line and the projection are formed of a single layer to be in continuity with each other.
Claims5
A method of fabricating a phase-change memory device, the method comprising:
- forming a word line over a semiconductor substrate;
- forming a diode layer over the word line;
- forming a phase-change layer over the diode layer;
- patterning the phase-change layer by etching, thereby forming a phase-change line in a line shape extending to a first direction;
- patterning the diode layer by etching, thereby forming a diode line in the same shape as the phase-change line;
- filling an insulating layer in a space formed through the patterning of the phase-change layer and the diode layer;
- depositing a conductive layer over the insulating layer and the phase-change line;
- patterning the conductive layer and the phase-change line by etching, thereby respectively forming a bit line and a phase-change line pattern in a line shape extending to a second direction perpendicular to the first direction;
- and
- etching the exposed diode layer using a bit line as a mask, thereby forming a line-shaped heating electrode and simultaneously confining a line-shaped diode.
7 more elements
Dependencies are inferred from the claim text.