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US 8,999,744 B2Granted
Avalanche photodiodes and methods of fabricating the same
AssigneeElectronics and Telecommunications Research Institute
InventorsMi-Ran Park, O-Kyun Kwon
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Abstract
Provided are an avalanche photodiode and a method of fabricating the same. The method of fabricating the avalanche photodiode includes sequentially forming a compound semiconductor absorption layer, a compound semiconductor grading layer, a charge sheet layer, a compound semiconductor amplification layer, a selective wet etch layer, and a p-type conductive layer on an n-type substrate through a metal organic chemical vapor deposition process.
Claims5
A method of fabricating an avalanche photodiode, comprising:
- forming a compound semiconductor absorption layer, a compound semiconductor grading layer, a charge sheet layer, a compound semiconductor
- amplification layer, a selective wet etch layer, and a p-type conductive layer on an n-type substrate, wherein the compound semiconductor absorption layer, the compound semiconductor grading layer, the charge sheet layer, the compound semiconductor amplification layer, the selective wet etch layer, and the p-type conductive layer are sequentially formed on the n-type substrate through a metal organic chemical vapor deposition process;
- forming a p-type conductive mesa pattern by performing a plasma dry etch process on the p-type conductive layer;
- and
- forming an undercut region and a selective wet etch layer aperture pattern under the p-type conductive mesa pattern by performing a wet etch process on the selective wet etch layer by using the p-type conductive mesa pattern as an etch mask.
2 more elements
Dependencies are inferred from the claim text.