Method of making molded LED package

A method of packaging a light emitting diode (LED), comprising:

• providing a lead frame comprising a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface;
• placing a LED die over a top surface of at least one of the first and the second leads;
• electrically connecting the LED die to the first lead and to the second lead;
• forming a package around the LED die, the first lead and the second lead, the package having an opening in its upper surface exposing at least the LED die;
• and
• separating the package containing the LED die, the first lead and the second lead from the lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, wherein the step of separating the package from the lead frame comprises dicing or snapping the package from the lead frame to expose the first castellation and the second castellation in the side surface of the package;
• wherein:
• the first castellation exposes at least one of the first lead and a first platable metal which is electrically connected to the first lead;
• and
• the second castellation exposes at least one of the second lead and a second platable metal which is electrically connected to the second lead, wherein the method further comprising forming the first platable metal in the first recess on the first lead and forming the second platable metal in the second recess on the second lead, wherein the first castellation exposes an edge of the first lead and the first platable metal, and the second castellation exposes an edge of the second lead and the second platable metal.