Automatic optimization of etch process for accelerated yield ramp with matched charged particle multi-beam systems

A method of writing resist-coated substrates using charged particle beams, comprising the actions of:

• writing multiple cut features specified by a design layout database onto at least one substrate;
• etching said substrate using etch parameters;
• imaging said features, said features being targeted in at least partial dependence on the design layout database;
• automatically identifying one or more defects in ones of said features in at least partial dependence on said imaging and the design layout database;
• automatically modifying at least one of said etch parameters, in at least partial dependence on said identifying;
• and
• repeating at least said writing and said etching using said modified etch parameters;
• wherein said writing and said imaging use multiple charged particle beams produced by multiple columns that are substantially the same, different ones of said beams targeting different portions of the substrate;
• and
• wherein the stages on which the substrate is mounted during said writing and said imaging are substantially the same.