US 8,999,627 B1 · Matched multiple charged particle beam systems for lithographic patterning, inspection, and accelerated yield ramp

Abstract

The present application discloses methods, systems and devices for using charged particle beam tools to pattern and inspect a substrate. The inventors have discovered that it is highly advantageous to use write and inspection tools that share the same or substantially the same stage and the same or substantially the same designs for respective arrays of multiple charged particle beam columns, and that access the same design layout database to target and pattern or inspect features. By using design-matched charged particle beam tools, correlation of defectivity is preserved between inspection imaging and the design layout database. As a result, image-based defect identification and maskless design correction, of random and systematic errors, can be performed directly in the design layout database, enabling a fast yield ramp.

Claims24

Dependent claims

A method of writing resist-coated substrates using multiple charged particle beams, comprising the actions of:

writing multiple cut features specified by a design layout database onto at least one substrate;
imaging said features, said features being targeted in at least partial dependence on the design layout database;
automatically identifying one or more defects in ones of said features in at least partial dependence on said imaging and the design layout database;
automatically modifying the design layout database, in at least partial dependence on said identifying;
and
repeating at least said writing using said modified design layout database;
wherein said writing and said imaging use multiple charged particle beams produced by multiple columns that are substantially the same, different ones of said beams targeting different portions of the substrate;
and
wherein the stages on which the substrate is mounted during said writing and said imaging are substantially the same.

6 more elements

A method of writing resist-coated substrates using charged particle beams, comprising the actions of:

writing multiple cut features specified by at least one design layout database onto at least one substrate;
imaging said features, said features being targeted in at least partial dependence on the design layout database;
automatically identifying one or more defects in ones of said features in at least partial dependence on said imaging and the design layout database;
automatically modifying the design layout database, in at least partial dependence on said identifying, to lower the rate of yield-reducing ones of said defects;
and
iteratively repeating said writing, said imaging, said identifying and said modifying using successively modified ones of the design layout database;
wherein said writing and said imaging use multiple charged particle beams produced by multiple columns that are substantially the same, different ones of said beams targeting different portions of the substrate;
and
wherein the stages on which the substrate is mounted during said writing and said imaging are substantially the same.

6 more elements

Dependencies are inferred from the claim text.

Matched multiple charged particle beam systems for lithographic patterning, inspection, and accelerated yield ramp

Life of this patent

Matched multiple charged particle beam systems for lithographic patterning, inspection, and accelerated yield ramp

Life of this patent

Abstract

Claims24