Pattern forming method, chemical amplification resist composition and resist film
AssigneeFUJIFILM Corporation
InventorsYuichiro Enomoto, Sou Kamimura, Shinji Tarutani, Keita Kato, Kaoru Iwato
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AssigneeFUJIFILM Corporation
InventorsYuichiro Enomoto, Sou Kamimura, Shinji Tarutani, Keita Kato, Kaoru Iwato
Estimating the term…
A pattern forming method includes: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a crosslinking agent; and (D) a solvent, a negative chemical amplification resist composition used in the method, and a resist film formed from the negative chemical amplification resist composition.
A pattern forming method, comprising:
A chemical amplification resist composition, comprising:
A pattern forming method, comprising:
A chemical amplification resist composition, comprising:
A chemical amplification resist composition, comprising:
A chemical amplification resist composition, comprising:
A chemical amplification resist composition, comprising:
A chemical amplification resist composition, comprising:
A chemical amplification resist composition, comprising:
Dependencies are inferred from the claim text.