Solder joint
AssigneeNihon Superior Sha Co., Ltd.
InventorTetsuro Nishimura
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Abstract
A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
Claims19
A solder joint soldered with an alloy consisting of:
- 0.01% by weight Cu, 0.001-6% by weight Ni, and the remaining of Sn;
- wherein the solder joint comprises an intermetallic compound having the general formula of (Cu,Ni)6Sn5 with a substitution ratio between Cu and Ni of about 5 Cu:
- 1 Ni;
- wherein the intermetallic compound comprises about 9 atom % Ni;
- and
- wherein the intermetallic compound, when solidified, has a hexagonal crystalline structure.
A solder joint soldered with an alloy consisting of:
- 7.6% by weight Cu, 0.001-6% by weight Ni, and the remaining of Sn;
- wherein the solder joint comprises an intermetallic compound having the general formula of (Cu,Ni)6Sn5 with a substitution ratio between Cu and Ni of about 5 Cu:
- 1 Ni;
- wherein the intermetallic compound comprises about 9 atom % Ni;
- and
- wherein the intermetallic compound, when solidified, has a hexagonal crystalline structure.
Dependencies are inferred from the claim text.