Cover tape, method for manufacturing cover tape, and electronic part package

A cover tape having a temperature at which heat shrinkage rates in both a machine direction and a transverse direction perpendicular to the machine direction are 5% or more between 80° C. to 200° C.,

• wherein the cover tape has a temperature T1 and a temperature T2 satisfying following formulae (i),(ii),(iii), and (iv) in both the machine direction and the transverse direction:
• 0° C.<T1−T2 ≦60° C. (i)
• S1 −S2 ≧25% (ii)
• 80° C.≦T1 ≦200° C. (iii)
• 60° C.≦T2 (iv)
• wherein S1 denotes a heat shrinkage rate (%) at a temperature T1, and S2 denotes a heat shrinkage rate S2 (%) at a temperature T2, and
• wherein the cover tape comprises a base material layer composed of a resin composition containing a polyolefin-based resin;
• a seal layer constituting a surface for heat sealing;
• and an intermediate layer composed of a resin composition containing a polyolefin-based resin disposed between the base material layer and the seal layer.