# US 8,999,487 B2 · Systems and methods for protection of cosmetic surfaces and overflow prevention on electronic devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,999,487 B2 - Document ID: US8999487B2 - Status: Granted - Kind: B2 - Application number: 13/607,538 - Filed: 2012-09-07 - Published: 2014-03-13 - Granted: 2015-04-07 - Earliest claimed: 2012-09-07 - Assignees: Apple Inc. - Applicants: Andrew M. Berg; Michael B. Wittenberg; Sawyer I. Cohen - Inventors: Andrew M. Berg; Michael B. Wittenberg; Sawyer I. Cohen - Web page: https://patentgrep.com/patent/US8999487B2 ## CPC - B32B 7/027: Thermal properties - B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12} - B32B 17/067: {of fibres or filaments} - C09J 7/35: Heat-activated - H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2301/124: the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape - C09J 2461/00: Presence of condensation polymers of aldehydes or ketones - Y10T 156/10: Methods of surface bonding and/or assembly therefor - Y10T 156/1039: Surface deformation only of sandwich or lamina [e.g., embossed panels] - Y10T 156/1062: Prior to assembly - Y10T 156/108: Flash, trim or excess removal - Y10T 428/24322: Composite web or sheet - Y10T 428/24331: including nonapertured component - Y10T 428/24959: of adhesive layers - Y10T 428/2826: Synthetic resin or polymer - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Systems and methods for protection of cosmetic surfaces on electronic devices and adhesive overflow prevention are provided. In particular, an assembly for protecting a cosmetic surface can include a heat activated adhesive, such as a heat active film adhesive (“HAF”), which can be used to secure a mesh to the cosmetic surface. In some embodiments, a protective layer having a center layer laminated between two layers of heat activated adhesive can be used to protect the cosmetic surface from scratches caused by the mesh. In some embodiments, one or more hot shoes can be used to cross-link the heat activated adhesives to the mesh and the cosmetic surface. Because the shape of a shoe can influence the flow of heat activated adhesives during cross-linking, different shoes can be selected in order to minimize overflow in certain locations in the assembly. ## Claims ### Claim 1 An electronic device, comprising: glass with ink on a first side of the glass, the glass comprising a through-hole; an adhesive layer having first and second sides, a protective layer between the first and second sides, and a cutout aligned with the through-hole; and a mesh secured to the first side of the glass to cover the through-hole, wherein the first and second sides of the adhesive layer comprise cross-linked heat activated adhesive that, on the first side, secures the adhesive layer to the first side of the glass, and on the second side, secures the adhesive layer to the mesh. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the cross-linked heat activated adhesive is a heat active film adhesive (“HAF”). ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the protective layer comprises a porous material. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein the protective layer comprises at least one of a non-woven paper material having a higher melting temperature than the cross-linked heat activated adhesive, a plastic material, a fabric of glass, a fabric of natural fibers, and a metal foil. ### Claim 5 (depends on 4) The electronic device of claim 4, wherein the plastic material comprises at least one of a polyethylene terephthalate (“PET”) and polyimide (“PI”). ### Claim 6 (depends on 4) The electronic device of claim 4, wherein the metal foil is micro-perforated. ### Claim 7 (depends on 6) The electronic device of claim 6, wherein the metal foil is micro-perforated using at least one of die-cutting, laser cutting, and chemical etching. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the mesh is a woven metal weave comprising a plurality of sharp edges, and wherein the protective layer prevents the plurality of sharp edges of the mesh from scratching the ink on the glass. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the mesh is a matte textured mesh. ### Claim 10 An electronic device, comprising: a glass layer having at least one opening; a mesh attached to an interior surface of the glass layer, wherein the mesh covers the at least one opening in the glass layer; and a heat activated thermoset adhesive interposed between the glass layer and the mesh that attaches the mesh to the interior surface, wherein the heat activated thermoset adhesive has a hole that that aligns with the at least one opening. ### Claim 11 (depends on 10) The electronic device defined in claim 10 wherein the heat activated thermoset adhesive comprises first and second layers of heat activated thermoset film and a protective layer interposed between the first and second layers of heat activated thermoset film. ### Claim 12 (depends on 11) The electronic device defined in claim 11 wherein the protective layer comprises plastic. ### Claim 13 (depends on 11) The electronic device defined in claim 11 wherein the protective layer comprises metal foil. ### Claim 14 (depends on 11) The electronic device defined in claim 11 wherein the protective layer comprises perforations and wherein the first and second layers of heat activated thermoset film are in contact with each other through the perforations. ### Claim 15 (depends on 11) The electronic device defined in claim 11 further comprising a layer of ink formed on the interior surface of the glass layer, wherein the protective layer prevents the mesh from contacting the layer of ink. ### Claim 16 (depends on 11) The electronic device defined in claim 11 wherein the first layer of heat activated thermoset film is attached to the interior surface of the glass layer, wherein the second layer of heat activated film is attached to the mesh, and wherein the second layer of heat activated thermoset film is thicker than the first layer of heat activated thermoset film. ### Claim 17 (depends on 10) The electronic device defined in claim 10 further comprising: a layer of ink formed on the interior surface of the glass layer; and a layer of hard-coat formed over the layer of ink, wherein the layer of hard-coat forms a barrier between the heat activated thermoset adhesive and the layer of ink. ### Claim 18 (depends on 10) The electronic device defined in claim 10 wherein the at least one opening forms an acoustic opening.