Methods for adjusting adhesion strength during sensor processing
AssigneeStmicroelectronics Pte Ltd
InventorsYing Yu, TienChoy Loh, ShianYeu Kam
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Abstract
The present disclosure is directed to systems and methods for adjusting adhesion strength between materials during semiconductor sensor processing. One or more embodiments are directed to using various surface treatments to a substrate to adjust adhesion strength between the substrate and a polymer. In one embodiment, the surface of the substrate is roughened to decrease the adhesive strength between the substrate and the polymer. In another embodiment, the surface of the substrate is smoothed to increase the adhesive strength between the substrate and the polymer.
Claims20
A method comprising:
- treating a surface of a substrate to increase an average roughness value of the surface of the substrate;
- applying a polymer to the surface of the substrate;
- curing the polymer in a manner that causes the polymer to shrink, wherein shrinking the polymer and roughening the surface of the substrate reduces an adhesive bond between the polymer and the surface of the substrate;
- and
- forming a sensor on the polymer.
A method comprising:
- etching a surface of a glass substrate to roughen the surface;
- depositing polyimide to the roughened surface of the glass substrate, the polyimide having first dimensions;
- curing the polyimide;
- shrinking the polyimide to second dimensions when cured, wherein etching and shrinking the polyimide reduces an adhesive bond between the polymer and the surface of the substrate;
- and
- forming a sensor on the polyimide.
A method comprising:
- treating a surface of a substrate that increases an average roughness value of the surface of the substrate;
- applying polyimide to the surface of the substrate;
- curing the polyimide thereby causing the polyimide to shrink, wherein shrinking the polymer and increasing the roughness of the surface of the substrate reduces an adhesion strength between the polymer and the surface of the substrate;
- and
- forming a sensor on an exposed surface of the polyimide.
Dependencies are inferred from the claim text.