Method of forming a thermal barrier coating system with engineered surface roughness
AssigneesSiemens Energy, Inc., Mikro Systems, Inc.
InventorsAndrew J. Burns, Gary B. Merrill, John R. Paulus
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Abstract
A method of manufacturing a substrate (16) with a ceramic thermal barrier coating (28, 32). The interface between layers of the coating contains an engineered surface roughness (12, 24) to enhance the mechanical integrity of the bond there between. The surface roughness is formed in a surface of a mold (10,20) and is infused by a subsequently cast layer of material (16, 28). The substrate may be partially sintered (76) prior to application of the coating layer(s) and the coated substrate and coating layer(s) may be co-sintered to form a fully coherent strain-free interlayer.
Claims4
A method of forming a thermally insulated component, the method comprising:
- forming a first mold comprising an engineered surface exhibiting a first surface roughness characteristic;
- casting a first powder and binder mixture in the first mold to form a green body comprising a first surface having the first surface roughness characteristic;
- removing the green body from the first mold;
- forming a second mold comprising an engineered surface exhibiting a second surface roughness characteristic;
- inserting the green body into the second mold;
- casting a second powder and binder mixture in a space between the green body and the second mold to form a green body with a secondary coating comprising a second surface having the second surface roughness characteristic;
- removing the green body with the secondary coating from the second mold;
- and
- applying a layer of ceramic insulating material onto the second surface.
Dependencies are inferred from the claim text.