Method for manufacturing a device on a substrate

A method for manufacturing a lower electrode of a piezoelectric device on a substrate, the method comprising:

• forming a layer structure on the substrate, wherein the layer structure comprises a conductive material;
• forming an auxiliary layer on the layer structure;
• forming a planarization layer on the auxiliary layer and on the substrate;
• exposing a portion of the auxiliary layer;
• applying a chemical-mechanical-polishing such that the planarization layer comprises a smaller thickness than a layer thickness of both the auxiliary layer and the layer structure,
• wherein, after the chemical-mechanical-polishing, the thickness of the planarization layer is the same as a thickness of the layer structure;
• and
• selectively removing the auxiliary layer to form a substantially planar surface of the auxiliary layer and the planarization layer.

A method for manufacturing a device on a substrate, the method comprising:

• forming a layer sequence on the substrate;
• structuring the layer sequence by exposing part of the substrate to define a region;
• forming a first part of an auxiliary layer on the structured layer sequence and a second part of the auxiliary layer on the part of the substrate;
• forming a planarization layer on the first and second part of the auxiliary layer;
• exposing the first part of the auxiliary layer by performing chemical-mechanical-polishing, wherein the chemical-mechanical-polishing comprises a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and wherein the first removal rate is greater than the second removal rate, wherein a thickness of the layer sequence is about equal to a combined thickness of the remaining planarization layer and the second part of the auxiliary layer;
• and
• removing the first part of the auxiliary layer from the layer sequence to form a substantially planar surface of the layer structure with the planarization layer.