Joining of mouldings of different polyamide compounds
AssigneeEvonik Degussa GmbH
InventorsSonja Bollmann, Rainer Goering, Franz-Erich Baumann, Andreas Dowe, Vera Schiemann
Life of this patent
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Abstract
A molding compound for joining two moldings each made of a PA11 and/or PA12 molding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ω-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 molding and to a PA12 molding.
Claims14
A method of bonding at least a first molding, and a second molding, comprising:
- welding at least a first preformed molding made of a PA11 molding compound and a second preformed molding made of a PA12 molding compound with a molding composition therebetween, wherein the molding composition comprises at least 50% by weight of a polyamide component, and wherein said polyamide component comprises at least one selected from the group consisting of PA1012, PA1210, PA1212, PA814, PA1014, PA618, PA11 and PA12, with the proviso that if either PA11 or PA12 or both PA11 and PA12 are present in said polyamide component, said polyamide component comprises not more than 80% by weight of either one of PA11 and PA12.
Dependencies are inferred from the claim text.