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US 8,999,063 B2Granted
Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method
AssigneeNuFlare Technology, Inc.
InventorHideki Ito
Life of this patent
Estimating the term…
Abstract
A susceptor includes a first step portion on which a wafer is placed; and a convex portion placed on a bottom surface of the first step portion, wherein a void is formed between a top surface of the convex portion and a rear surface of the wafer in a state in which the wafer is placed on the top surface of the convex portion.
Claims6
A susceptor for holding a wafer, the susceptor comprising:
- an inner susceptor having a diameter smaller than a diameter of the wafer, the inner susceptor comprising a first surface and a convex portion formed on the first surface, the convex portion for temporary placement thereon of the wafer;
- and
- an outer susceptor comprising:
- a first step portion having:
- an opening at the center of the first step portion, the opening being blocked by the inner susceptor, and
- a first upper stage;
- a second step portion having a second upper stage, the second step portion being formed above the first upper stage, and the second upper stage receiving the wafer from the convex portion, wherein a void is formed between a top surface of the convex portion and the rear surface of the wafer when the second upper stage receives the wafer.
4 more elements
A semiconductor manufacturing apparatus comprising:
- a reaction chamber into which a wafer is conveyed;
- a gas supply mechanism configured to supply a process gas into the reaction chamber;
- a gas exhausting mechanism configured to exhaust the process gas from the reaction chamber;
- an inner susceptor having a diameter smaller than a diameter of the wafer, the inner susceptor comprising a first surface and a convex portion formed on the first surface, the convex portion for temporary placement thereon of the wafer;
- and
- an outer susceptor comprising:
- a first step portion having:
- an opening at the center of the first step portion, the opening being blocked by the inner susceptor, and
- a first upper stage;
- and
- a second step portion having a second upper stage, the second step portion being formed above the first upper stage, and the second upper stage receiving the wafer from the convex portion, wherein a void is formed between a to surface of the convex portion and the rear surface of the wafer when the second upper stage receives the wafer;
- a heater configured to heat the wafer from a lower side of the inner susceptor and the outer susceptor;
- a rotating mechanism configured to rotate the wafer;
- and
- a push-up pin configured to penetrate the heater and to vertically move the inner susceptor.
12 more elements
Dependencies are inferred from the claim text.