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US 8,998,689 B2Granted
Cooling mechanism
AssigneeNEC Corporation
InventorTomoyuki Mitsui
Life of this patent
Estimating the term…
Abstract
A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.
Claims2
A cooling mechanism for cooling an object, comprising:
- a duct that leads a fluid for cooling;
- multiple fans that are placed in the duct and send the fluid for cooling;
- and
- a bypass channel that detours at least one of the multiple fans, wherein:
- the duct is a first duct;
- the cooling mechanism further comprising a plurality of second ducts provided inside the first duct and the multiple fans wherein
- the second ducts are aligned coaxially,
- a first fan of one of the multiple fans provided outside the second ducts in the first duct;
- and
- a second fan of one of the multiple fans provided to each one of the second ducts,
- the bypass channel includes space outside the second duct and inside the first duct;
- and
- the cooling mechanism discharges the fluid for cooling supplied from an inlet side of the first duct via the bypass channel, wherein:
- the first duct includes a first space and a second space connected to the first space by an opening;
- the first space includes the first fan;
- the second space includes the second ducts;
- the first space is provided on the inlet side of the second space or the outlet side of the second space;
- the cooling mechanism includes a gap between the first space and at least one of the second fans;
- and
- the fluid for cooling is flowable into or out of the bypass channel via the gap.
17 more elements
Dependencies are inferred from the claim text.