# US 8,998,458 B2 · LED plastic heat sink and method for making and using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,998,458 B2 - Document ID: US8998458B2 - Status: Granted - Kind: B2 - Application number: 13/483,555 - Filed: 2012-05-30 - Published: 2012-12-06 - Granted: 2015-04-07 - Earliest claimed: 2011-05-31 - Assignees: Sabic Global Technologies B.V. - Applicants: Triloka Chander Tankala; Venkatesha Narayanaswamy; Arunachala Parameshwara; Poovanna Theethira Kushalappa; Seongnam Kang - Inventors: Triloka Chander Tankala; Venkatesha Narayanaswamy; Arunachala Parameshwara; Poovanna Theethira Kushalappa; Seongnam Kang - Web page: https://patentgrep.com/patent/US8998458B2 ## CPC - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - B29C 45/0001: {characterised by the choice of material} - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - F21K 9/90: Methods of manufacture - F21S 41/143: the main emission direction of the LED being parallel to the optical axis of the illuminating device - F21S 41/151: arranged in one or more lines - F21S 41/192: {Details of lamp holders, terminals or connectors} - F21S 43/14: Light emitting diodes [LED] - F21S 43/195: {Details of lamp holders, terminals or connectors} - F21S 45/48: with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device - F21V 29/713: {in direct thermal and mechanical contact of each other to form a single system} - F21V 29/773: {the planes containing the fins or blades having the direction of the light emitting axis} - F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor - B29K 2995/0013: Conductive - F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes - F21V 29/89: Metals - F21Y 2115/10: Light-emitting diodes [LED] - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features. ## Claims ### Claim 1 A heat sink system, comprising: an integrally formed plastic heat sink, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK; a printed circuit board package, wherein the plastic heat sink comprises radially extending fins; an insert located in the plastic heat sink; and at least one of the following features the plastic heat sink comprises a wall between the fins with holes through the wall; insert holes that align with plastic heat sink holes; the insert comprises embossing; and the insert comprises lancing provisions and the lancing provisions comprise openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings. ### Claim 2 (depends on 1) The heat sink system of claim 1, wherein the thermal conductivity of the thermally conductive plastic is 2 to 6 W/mK. ### Claim 3 (depends on 1) The heat sink system of claim 1, wherein the heat sink system is free of independent attachment elements that attach the printed circuit board package to the plastic heat sink. ### Claim 4 (depends on 1) The heat sink system of claim 1, wherein the printed circuit board package further comprises a chip on board. ### Claim 5 (depends on 1) The heat sink system of claim 1, wherein no thermal interface material is located between the printed circuit board package and the plastic heat sink. ### Claim 6 (depends on 1) The heat sink system of claim 1, wherein the plastic heat sink and the insert each have a cylindrical shape. ### Claim 7 (depends on 6) The heat sink system of claim 6, wherein the insert comprises the lancing provisions and the lancing provisions comprise openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings. ### Claim 8 (depends on 6) The heat sink system of claim 6, wherein the plastic heat sink comprises the wall between the fins with the holes through the wall. ### Claim 9 (depends on 8) The heat sink system of claim 8, wherein the insert comprises the insert holes, and wherein the insert holes align with the plastic heat sink holes. ### Claim 10 (depends on 6) The heat sink system of claim 6, wherein the insert comprises the embossing. ### Claim 11 (depends on 1) The heat sink system of claim 1, wherein the insert is metal. ### Claim 12 (depends on 1) The heat sink system of claim 1, wherein the insert is a sheet metal insert. ### Claim 13 A heat sink system, comprising an integrally formed plastic heat sink and printed circuit board package; wherein the plastic heat sink comprises: 35 vol % to 80 vol % of a thermoplastic polymer; 5 vol % to 45 vol % of a low thermal conductivity, electrically insulative filler with an intrinsic thermal conductivity of 10 W/mK to 30 W/mK; 2 vol % to 15 vol % of a high thermal conductivity, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and 2 vol % to 15 vol % of a high thermal conductivity, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK. ### Claim 14 A light comprising: a housing, a heat sink system comprising a printed circuit board package; a plastic heat sink, wherein the plastic heat sink comprises radially extending fins and wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK; an insert located in the plastic heat sink; and at least one of the following features the plastic heat sink comprises a wall between the fins with holes through the wall; insert holes that align with plastic heat sink holes; the insert comprises embossing; and the insert comprises lancing provisions and the lancing provisions comprise openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings; a reflector located in the housing in optical communication with an LED of the printed circuit board package; and a lens covering the printed circuit board package. ### Claim 15 A heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the system comprises at least one of the following features; the plastic heat sink comprises a wall between the fins with holes through the wall; insert holes that align with plastic heat sink holes; the insert comprises embossing; and the insert comprises lancing provisions and the lancing provisions comprise openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings. ### Claim 16 (depends on 15) The heat sink system of claim 15, wherein the insert comprises the lancing provisions and the lancing provisions comprise openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings. ### Claim 17 (depends on 15) The heat sink system of claim 15, wherein the plastic heat sink comprises the wall between the fins with the holes through the wall. ### Claim 18 (depends on 17) The heat sink system of claim 17, wherein the insert comprises the insert holes that align with the plastic heat sink holes. ### Claim 19 (depends on 15) The heat sink system of claim 15, wherein the insert comprises the embossing. ### Claim 20 (depends on 15) The heat sink system of claim 15, further comprising an integrally formed printed circuit board package. ### Claim 21 A method of making an integral hybrid-heat sink system, comprising: inserting an insert into a mold; melting a thermally conductive plastic; introducing the melted thermally conductive plastic into the mold and into contact with the insert to form a plastic heat sink around the insert upon cooling; and cooling the thermally conductive plastic to form the integral heat sink system, wherein the plastic heat sink and the insert each have a cylindrical shape, and wherein the insert comprises at least one of the following features the insert comprises lancing provisions comprising openings formed by protrusions extending into the insert, with the thermally conductive plastic extending into the openings; the plastic heat sink comprises radially extending fins with walls between the fins and holes through the walls; insert holes that align with plastic heat sink holes; and the insert comprises embossing. ### Claim 22 (depends on 21) The method of claim 21, wherein the insert comprises the lancing provisions. ### Claim 23 (depends on 21) The method of claim 21, wherein the insert comprises the embossing. ### Claim 24 (depends on 21) The method of claim 21, wherein the plastic heat sink comprises the radially extending fins with the walls between the fins and the holes located through the walls. ### Claim 25 (depends on 21) The method of claim 21, further comprising disposing a printed circuit board package into the mold prior to introducing the melted thermally conductive plastic into the mold.