Flexible electronic assembly and method of manufacturing the same

A flexible circuit assembly for accommodating a plurality of power electronic devices, comprising:

• an insulating cover layer having first openings, the first openings configured to receive the plurality of power electronic devices at least partially inside the first openings;
• a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, the flexible conductive layer having a plurality of islands and conductive traces, the first openings arranged above the islands;
• an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, the second openings arranged below the islands;
• a plurality of heat-conductive elements arranged inside the second openings;
• a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material;
• and
• a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material,
• wherein the flexible circuit assembly is bendable to a bending radius of 3 cm without cracking the insulating cover layer, the flexible conductive layer, the intermediate insulating layer.