Method for manufacturing a fluid ejection device and fluid ejection device

A method for manufacturing a fluid ejection device, the method comprising:

• forming a first recess in a first semiconductor body by removing selective portions of the first semiconductor body, the first semiconductor body including a membrane layer and a piezoelectric actuator located over the membrane, wherein the selective portions are removed until the membrane layer is reached;
• forming an intermediate through hole through the membrane layer by removing a selective portion of the membrane layer;
• providing a second semiconductor body having a first surface and a second surface;
• forming a second recess in a third semiconductor body;
• forming an outlet through hole in the third semiconductor body by removing selective portions of the third semiconductor body outside of said second recess, said outlet through hole being a fluid ejection nozzle of the fluid ejection device;
• coupling together the first and third semiconductor bodies, wherein the coupling includes housing the piezoelectric actuator in the first recess, wherein the intermediate through hole, the first recess, and the outlet through hole are fluidically coupled to each other;
• and
• coupling together the first and second semiconductor bodies, wherein the coupling includes forming a chamber inside the fluid ejection device with a first surface of the second semiconductor body facing the first recess.