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US 8,998,384 B2Granted
Circuits and methods using a non-gold corrosion inhibitor
AssigneesHewlett-Packard Development Company, L.P., 3M Innovative Properties Company
InventorsLynn Walsh, Mark Walsh, Ronald L. Imken, Soon Yeng Chan, Alejandro Aldrin A. Narag, II
Life of this patent
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Abstract
A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.
Claims10
An ink ejection device, comprising:
- a semiconductor die configured to control ink ejection elements;
- and
- a flex circuit having copper leads, the copper leads separately coated with a non-gold corrosion inhibitor comprising benzotriazole and electrically connected to the semiconductor die.
An inkjet cartridge, comprising:
- a housing including a reservoir therein for holding ink;
- a printhead affixed to the housing, the printhead having ink ejection elements operatively connected to the reservoir for ejecting ink drops from the printhead;
- and
- a flex circuit having copper leads at one part of the flex circuit connected to the printhead and electrical contacts at another part of the flex circuit for connecting the printhead to an external circuit, the copper leads being coated with benzotriazole and bonded to gold connection points on the printhead.
1 more element
An ink ejection device, comprising:
- a housing;
- a semiconductor die configured to control ink ejection elements that is attached to the housing;
- a flex circuit with copper leads;
- and
- a eutectic bond between each of the copper leads and gold electrical connection points on the semiconductor die to form an interconnect circuit.
2 more elements
Dependencies are inferred from the claim text.