Substrate inverting device, substrate inverting method, and peeling system
AssigneeTokyo Electron Limited
InventorsYasuharu Iwashita, Osamu Hirakawa, Masaru Honda, Akira Fukutomi
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsYasuharu Iwashita, Osamu Hirakawa, Masaru Honda, Akira Fukutomi
Estimating the term…
According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.
A substrate inverting device for inverting front and rear surfaces of a substrate, comprising:
Dependencies are inferred from the claim text.