Micromachined gyroscope with detection in the plane of the machined wafer

A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, said gyroscope comprising:

• two symmetrical moving assemblies coupled by a coupling structure connecting the two moving assemblies so as to allow mechanical vibration energy to be transferred between said two moving assemblies, each moving assembly comprising
• a first moving element connected to the coupling structure and able to vibrate with two degrees of freedom in orthogonal Ox and Oy directions of the plane of the wafer, and
• a second moving element intended to vibrate only along the Oy direction and connected to fixed anchoring zones via linkage means for linking the second moving element to the anchoring zones that do not allow the second moving element to move in the Ox direction, said second moving element being adjacent the first moving element and connected to the first moving element via linkage means;
• wherein the linkage means allow the transmission, in phase opposition, to the second moving element of the vibration movement of the first moving element in the Oy direction,
• wherein the linkage means comprise at least two linkage assemblies for linking the first moving element with the second moving element, the linkage assemblies comprising at least one linkage element comprising a narrow elongate flexure beam which has a high resistance to elongation in the Oy direction and a low stiffness in the Ox direction connected to a transmitting means for transmitting, in phase opposition, a movement of the first moving element in the Oy direction to the second moving element,
• wherein the linkage assemblies comprise a single linkage element connected on one side to the first moving element and on the other side to the second moving element,
• wherein the transmitting means for transmitting, in phase opposition, a movement of the first moving element in the Oy direction to the second moving element, is a lever connected on one side to the beam and on the other side to one of the two moving elements, the beam is further connected to the moving element adjacent that to which the lever is connected, and
• wherein the lever being linked with an anchoring zone so as to pivot about a pivot axis extending along an Oz direction perpendicular to the plane of the wafer lying between the first beam and the moving element to which the lever is connected.