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US 8,997,344 B2Granted
Method for manufacturing interposer
AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Shuichi Kawano, Daiki Komatsu, Hiroshi Segawa
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Abstract
A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.
Claims20
A method for manufacturing an interposer comprising:
- forming a first insulating layer comprising an inorganic material on a supporting substrate;
- forming a first wire in the first insulating layer;
- forming a second insulating layer on a first side of the first insulating layer;
- forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer;
- removing the supporting substrate;
- forming a third wire in the first insulating layer;
- forming a third insulating layer on a second side of the first insulating layer;
- and
- forming a fourth wire with a longer wire length and a greater thickness than the third wire on the third insulating layer.
6 more elements
Dependencies are inferred from the claim text.