Method for manufacturing multilayer printed circuit board

A method for manufacturing multilayer printed circuit board, comprising:

• providing an elongated metal substrate having a first surface and an opposite second surface, the metal substrate comprising a plurality of substrate units arranged along a longitudinal direction thereof, each substrate unit comprising a layer template and a border region surrounding the layer template;
• attaching a first insulating layer to the metal substrate, the first insulating layer having a plurality of first through holes proximate to the first surface of the metal substrate, each first through hole being arranged directly above a corresponding layer template;
• forming electrically conductive circuits by removing a portion of each layer template, a part of each electrically conductive circuit being exposed through the corresponding first through hole;
• forming a second insulating layer on the second surface of the metal substrate, the second insulating layer having a plurality of second through holes, the second through holes being aligned with the respective first through holes, each electrically conductive circuit being exposed through the corresponding second through hole;
• forming a first metal cylinder in each first through hole, the first metal cylinder protruding from the first insulating layer;
• forming a second metal cylinder in each second through hole, the second metal cylinder protruding from the second insulating layer, the corresponding first and the second insulating layers of the electrically conductive circuits and the first and the second metal cylinders cooperatively forming circuit board units;
• and
• folding and laminating the circuit board units in a manner that the circuit board units are stacked one on another, the electrically conductive circuits of each two neighboring laminated circuit board units being electrically connected by means of aligning and contacting the first metal cylinders thereof or the second metal cylinders thereof.