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US 8,997,342 B2Granted
Method of fabrication, a multilayer electronic structure and structures in accordance with the method
AssigneeZhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
InventorsDror Hurwitz, Alex Huang
Life of this patent
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Abstract
A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle while maintaining pressure.
Claims16
A method of fabricating a multilayer electronic support structure comprising:
- electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures,
- placing a release film, having a hardness that is higher than a hardness of the resin of the pre-preg and lower than a hardness of a cured resin, over the dielectric pre-preg
- pressing to pressures of 200 to 600 PSI against the release film, and heating through a curing cycle whilst maintaining pressure;
- wherein the curing cycle comprises heating to a partial cure temperature and maintaining for 30 to 90 minutes, cooling down and applying a thinning and smoothing procedure selected from mechanical, chemical and chemical mechanical processing, and then heating to a full cure temperature for 30 to 90 minutes.
1 more element
Dependencies are inferred from the claim text.