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US 8,997,340 B2Granted
Method of manufacturing and insulating sheet
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKeungjin Sohn, Nobuyuki Ikeguchi, Joung-Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin, Jung-Hwan Park
Life of this patent
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Abstract
A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.
Claims22
A method of manufacturing an insulating sheet, the method comprising:
- providing a reinforcement material having a thermoplastic resin layer stacked thereon;
- stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate;
- and
- hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate at a temperature higher than the fusion point of the thermoplastic resin layer by 10 to 50° C. in a vacuum environment.
1 more element
A method of manufacturing a printed circuit board, the method comprising:
- providing a reinforcement material having a thermoplastic resin layer stacked on either side thereof;
- stacking the thermoplastic resin layer stacked on either side of the reinforcement material over a core substrate;
- hot pressing the reinforcement material and the thermoplastic resin layers onto the core substrate at a temperature higher than the fusion point of the thermoplastic resin layer by 10 to 50 ° C. in a vacuum environment;
- and
- forming a circuit pattern over the exposed thermoplastic resin layer.
2 more elements
Dependencies are inferred from the claim text.