Structure for mounting heat sink, and heat sink mounted using the structure

A structure for mounting a heat sink in which a heat sink body including a base compression-bonded to a semiconductor circuit element on a circuit board and heat radiation fins projecting from the base is mounted on the circuit board using a spring member, the structure comprising:

• first and second anchors for mounting the heat sink body on the circuit board with the anchors on the circuit board in a projected state to a mounting side of the heat sink body and the spring member to be indirectly attached at each of both ends of the spring member to respective ones of the first and second anchors to attach the heat sink body on the circuit board, wherein
• first and second attachment pieces each formed separately from the spring member are provided at respective ones of the both ends of the spring member,
• the first and second attachment pieces provided at respective ones of the both ends of the spring member are provided to be capable of pivoting or sliding with respect to the spring member,
• the first and second anchors each include a base section to be fixed to the circuit board and a main body section for projecting to the heat sink body side from the circuit board, and an attaching section to which the respective one of the first and second attachment pieces is to be attached is formed in the main body section,
• the main body section of each of the first and second anchors is formed in a substantially columnar shape or a regular prism shape, and
• a structure for indirectly attaching each of the both ends of the spring member to the respective ones of the first and second anchors in mounting the heat sink body on the circuit board is a structure for attaching the respective attachment pieces to the attaching section of the respective anchor in an externally fit state.