Charged particle multi-beamlet lithography system, modulation device, and method of manufacturing thereof

A method of manufacturing a modulation device comprising:

• providing a body comprising an interconnect structure comprising multiple metallization levels separated by via levels, each metallization level including one or more layers for making electrical connections within the one or more layers of the metallization level, and each via level comprising one or more layers provided with one or more interconnect areas, also referred to as vias, for mutually electrically connecting adjacent metallization layers, the interconnect structure further being provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements, wherein a modulator comprises a first electrode, and a second electrode, and wherein at least one of the first electrode and the second electrode comprises a first conductive element formed at a first metallization level of the multiple metallization levels of the interconnect structure-and ˜ a second conductive element formed at a second metallization level of the multiple metallization levels of the interconnect structure and a third conductive element formed at a third metallization level of the multiple metallization levels of the interconnect structure, the first, second and third metallization level being different from the first metallization levels, and the first, and˜ second and third conductive elements being electrically connected with each other so that the at least one of the first electrode and the second electrode extends over more than one two metallization levels of the multiple levels of the interconnect structure;
• and
• forming apertures extending through the body of the interconnect structure such that the first electrode and the second electrode of a modulator of the plurality of modulators are located on opposing sides of the aperture for generating an electric field across the aperture, and wherein the first, second and third conductive elements are exposed to the aperture so as to form part of the electrode.