Friable-resistant dielectric porcelain

A composition for forming a friable-resistant dielectric porcelain material, said composition comprising either (A) or (B) as follows:

• (A)
• feldspar at about 21% to about 27% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least 10 to 1;
• calcined alumina at about 32% to about 38% by weight, wherein at least 99.9% of the calcined alumina has a particle size less than about 44 microns;
• and
• clay at about 37% to about 43% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns;
• (B)
• feldspar at about 28% to about 34% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least about 10 to 1;
• crystalline silica at about 22% to about 28% by weight, wherein at least 99.9% of the crystalline silica has a particle size less than about 44 microns;
• and
• clay at about 41% to about 47% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns.