Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures

A method of protecting a substrate during fabrication of semiconductor or MEMS devices, the method comprising:

• receiving a substrate during fabrication of semiconductor or MEMS devices;
• applying a thin film coating over said substrate, said thin film coating having a thickness ranging from about 3 angstroms to about 1,000 angstroms, wherein a precursor material used to deposit said thin film coating is an organic-based precursor which includes at least one fluorine-comprising functional group at one end of a carbon back bone and at least one functional bonding group at an opposite end of said carbon backbone, wherein said carbon backbone ranges in length from 4 carbons to 12 carbons;
• and
• selectively removing portions of said thin film coating from the substrate to expose areas for connection to adjunct devices.

A method of protecting a semiconductor or MEMS substrate during packaging, comprising:

• receiving a substrate during packaging of semiconductor or MEMS devices;
• applying a protective hydrophobic coating over said substrate, said protective hydrophobic coating having a thickness ranging from 3 angstroms to 1,000 angstroms;
• performing a packaging operation on the substrate after applying the protective hydrophobic coating, the protective hydrophobic coating protecting the substrate during the performance of the packaging operation;
• and
• treating a surface of said protective hydrophobic coating with a fluid to remove debris therefrom, the debris having accumulated during said packaging operation.