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US 8,986,588 B2Granted
Electronic device and process for manufacturing electronic device
AssigneeRenesas Electronics Corporation
InventorsKenji Uchida, Koki Hirasawa
Life of this patent
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Abstract
The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
Claims14
A process for manufacturing an electronic device, comprising:
- forming a frame member over a wafer which comprises a plurality of elements formed therein, the frame member being composed of a first resin and being installed over the wafer to surround a functional unit of the element;
- deforming the frame member so as to enlarge a width of the frame member by pressing an upper surface of the frame member by a metallic mold;
- injecting a second resin into a space formed between the metallic mold and the frame member that is deformed;
- and
- disassembling the metallic mold to form a void space between the frame member and the second resin by causing a reverse deformation of the frame member.
2 more elements
Dependencies are inferred from the claim text.