Method of manufacturing printed circuit board having bump

A method of manufacturing a printed circuit board having a bump, the method comprising:

• preparing a first carrier having a first circuit formed thereon, the first carrier comprising a metal;
• preparing a second carrier having a second circuit formed thereon, the second carrier comprising a metal;
• compressing the first carrier and the second carrier against one surface and the other surface of an insulation layer, respectively, such that the first circuit and the second circuit are buried;
• stacking an etching resist on the first carrier in accordance with where the bump is to be formed;
• forming the bump by etching the first carrier;
• and
• forming a via in the insulation layer such that the first circuit and the second circuit are electrically connected to each other,
• wherein the bump comprises a metal and is electrically connected to the first circuit.