Biosensor capacitor
AssigneeInternational Business Machines Corporation
InventorsKristin M. Ackerson, John J. Ellis-Monaghan, Jeffrey P. Gambino, Yen Li Lim, Polina A. Razina
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Abstract
A biosensor capacitor, including a dielectric layer; a first metal layer in the dielectric layer; a passivation layer over the dielectric layer and the first metal layer; an isolation layer over the passivation layer; a probe DNA electrode connected to the first metal layer; a counter electrode connected to the first metal layer wherein the counter electrode forms an enclosure around the probe DNA electrode; and a bond pad connected to the first metal layer.
Claims18
A biosensor capacitor, comprising:
- a dielectric layer;
- a first metal layer in the dielectric layer;
- a first diffusion barrier including a refractory metal over the first metal layer;
- a passivation layer over the dielectric layer and the first metal layer;
- an isolation layer over the passivation layer;
- a probe DNA electrode connected to the first metal layer;
- a counter electrode connected to the first metal layer wherein the counter electrode forms an enclosure around the probe DNA electrode;
- and
- a bond pad connected to the first metal layer.
A method, comprising:
- forming a bond pad via, a counter electrode via, and a probe DNA electrode via through an isolation layer and a passivation layer to a first metal layer in a dielectric layer;
- forming a first diffusion barrier in each via over the first metal layer;
- forming a probe DNA electrode by forming a second metal layer over the first diffusion barrier in the probe DNA electrode via;
- forming a counter electrode in the counter electrode via, wherein the counter electrode forms an enclosure around the probe DNA electrode via;
- and
- forming a bond pad in the bond pad via.
A biosensor capacitor, comprising:
- a dielectric layer;
- a first metal layer in the dielectric layer;
- a passivation layer over the dielectric layer and the first metal layer;
- an isolation layer over the passivation layer
- a probe DNA electrode including copper connected to the first metal layer;
- a counter electrode including copper connected to the first metal layer;
- a first diffusion barrier including a refractory metal over the counter electrode and the probe DNA electrode;
- a second metal layer over the first diffusion barrier;
- and
- a bond pad including copper connected to the first metal layer.
Dependencies are inferred from the claim text.