High strength and high thermal conductivity copper alloy tube and method for producing the same
AssigneeMitsubishi Shindoh Co., Ltd.
InventorKeiichiro Oishi
Life of this patent
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Abstract
A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.
Claims22
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- and
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- and
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co and P are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %;
- and
- at least one of Zn of 0.001 to 0.5 mass %, Mg of 0.001 to 0.2 mass %, and Zr of 0.001 to 0.1 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co and P are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- and
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]—0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, and a recrystallization ratio of a heat-influenced portion subject to the drawing process is 0%, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co, P, and either one of Ni or Fe are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %;
- and
- at least one of Zn of 0.001 to 0.5 mass %, Mg of 0.001 to 0.2 mass %, and Zr of 0.001 to 0.1 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, and a recrystallization ratio of a heat-influenced portion subject to the drawing process is 0%, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co, P, and either one of Ni or Fe are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- and
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein conductivity of the copper tube before the drawing process is 60% IACS or less,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co and P are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
- Co of 0.12 to 0.32 mass %;
- P of 0.042 to 0.095 mass %;
- Sn of 0.005 to 0.30 mass %;
- at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %;
- and
- at least one of Zn of 0.001 to 0.5 mass %, Mg of 0.001 to 0.2 mass %, and Zr of 0.001 to 0.1 mass %,
- wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities,
- wherein conductivity of the copper tube before the drawing process is 60% IACS or less,
- wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less, and
- wherein in a metal structure of a process end portion and a process center portion before the drawing process, after the drawing process, or after brazing with another copper tube, circular or oval fine precipitates having a size of 2 to 20 nm containing Co and P are uniformly dispersed, or 90% or more of all precipitates are uniformly dispersed as fine precipitates having a size of 30 nm or less.
Dependencies are inferred from the claim text.