Apparatus and method for indirect surface cleaning
AssigneeRave, LLC
InventorsJeffrey E. LeClaire, Kenneth G. Roessler, David Brinkley
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Abstract
Methods for cleaning a surface of a photomask and for increasing the useable lifetime of the photomask are disclosed. One method includes, a first wafer print processing using a photomask and a pellicle disposed across the photomask, and cleaning the photomask. The cleaning the photomask includes directing a laser beam through the pellicle toward the photomask, the laser beam having a wavelength that is substantially equal to a local maximum of an absorption spectrum of the photomask, heating the photomask with the laser beam, and transferring heat from the photomask to a contaminant disposed on the photomask, thereby thermally decomposing the contaminant.
Claims16
A wafer fabrication cleaning process, comprising:
- directing an energy source toward a photomask, the energy source including a wavelength that is substantially equal to a local maximum of an absorption spectrum of the photomask;
- heating the photomask with the energy source;
- and
- transferring heat from the photomask to a contaminant disposed on the photomask, decomposing the contaminant.
Dependencies are inferred from the claim text.