Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite
AssigneeRobert Bosch GmbH
InventorsDick Scholten, Michael Stumber, Franz Laermer, Ando Feyh
Life of this patent
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Abstract
A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.
Claims10
A porous microneedle array, comprising:
- a porous carrier zone formed at a face of a semiconductor substrate;
- plurality of microneedles disposed on a portion of the porous carrier zone between edge structures disposed on the face of the semiconductor substrate, wherein the edge structures vertically rise to above the plurality of microneedles;
- and
- a plastic cap positioned over the plurality of microneedles and covering the plurality of microneedles, wherein the plastic cap includes a surface extending continuously in a plane between flanges that interact with the edge structures for positioning the surface over the plurality of microneedles.
A substrate composite, comprising:
- a plurality of porous microneedle arrays formed on a front face of a semiconductor substrate, each microneedle array including:
- a porous carrier zone;
- and
- a plurality of microneedles above a portion of the porous carrier zone and between edge structures that vertically rise from the carrier zone to above the plurality of microneedles;
- and
- a plastic cap substrate positioned over the microneedle arrays, wherein the plastic cap substrate includes a plurality of surfaces that each extends continuously in a single plane and that are separated from each other by flanges that interact with the edge structures for positioning respective ones of the surfaces over respective ones of the plurality of porous microneedle arrays, each of the arrays including more than one microneedle.
A porous microneedle array, comprising:
- a porous carrier zone formed at a face of a semiconductor substrate;
- plurality of microneedles disposed on a portion of the porous carrier zone between edge structures disposed on the face of the semiconductor substrate;
- and
- a plastic cap positioned over the plurality of microneedles and covering the plurality of microneedles;
- wherein:
- the edge structures vertically rise to above the plurality of microneedles;
- the plastic cap includes a substantially planar surface extending between flanges that interact with the edge structures for positioning the substantially planar surface over the plurality of microneedles;
- and
- an open space separates between the substantially planar surface and the plurality of microneedles over which the substantially planar surface is positioned.
Dependencies are inferred from the claim text.