Methods and apparatus for preparing power transmission cables
AssigneesTyco Electronics Corporation, Tyco Electronics Raychem GmbH
InventorsLadislaus Kehl, Terry Edward Frye
Life of this patent
Estimating the term…
Abstract
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.
Claims25
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- and
- applying an electrically conductive paint composition to the first semiconductive section and the exposed polymeric insulation layer to form a conductive paint coating thereon.
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- and thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- wherein the direction of rotation of the grinding surface is transverse to a plane defined by the dividing groove;
- and
- wherein a portion of the grinding surface engaging the semiconductive layer rotates in a direction away from the first semiconductive section.
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- and thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- wherein the first semiconductive section has a terminal edge and the dividing groove has an annular sidewall that tapers in a direction toward the terminal edge.
Dependencies are inferred from the claim text.