US 8,986,069 B2Granted

Polishing apparatus and polishing method

AssigneeEbara Corporation

InventorsTamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi

Life of this patent

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Abstract

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Claims7

Dependent claims

A polishing apparatus for polishing a notch portion of a substrate, said polishing apparatus comprising:

a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate;
plural polishing head modules each configured to polish the substrate using a polishing tape;
and
a moving mechanism including a single X-axis moving mechanism and plural Y-axis moving mechanisms configured to move said plural polishing head modules along a X axis and a Y axis which are perpendicular to each other, said X-axis moving mechanism being configured to move said plural polishing head modules synchronously along the X axis, and said plural Y-axis moving mechanisms being configured to move said plural polishing head modules independently of each other along the Y axis,
wherein each of said plural polishing head modules includes a polishing head configured to bring the polishing tape into sliding contact with the notch portion of the substrate, and a tape supplying and recovering mechanism configured to supply the polishing tape to said polishing head and recover the polishing tape from said polishing head.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/459,421Filed 30 Apr 2012 · division
Priority: JP 2007-3127243 Dec 2007
Published: US 2012/0208437 A116 Aug 2012
Granted: 24 Mar 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

B24B 21/002
Machines or devices using grinding or polishing belts ; Accessories therefor: for grinding edges or bevels
B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers
B24B 21/004
Machines or devices using grinding or polishing belts ; Accessories therefor: using abrasive rolled strips
B24B 21/008
Machines or devices using grinding or polishing belts ; Accessories therefor: machines comprising two or more tools or having several working posts

Family

Application12/292,662Parent of this division · filed 24 Nov 2008
US 2012/0208437 A1Pre-grant publication · published 16 Aug 2012
US 8,187,055 B2Parent of this division
US 2009/0142992 A1Published application
US 8,986,069 B2This patent

From the US filing history. Foreign family members aren’t listed.