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US 8,985,818 B2Granted
LED mounting substrate
AssigneeNitto Denko Corporation
InventorsDaisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
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Abstract
The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.
Claims7
An LED mounting substrate, comprising:
- a layer made of a composition containing boron nitride powder and a fluororesin, wherein
- the fluororesin contains polytetrafluoroethylene,
- the layer has a thermal conductivity of 2 W/(m·K) or more,
- the layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm,
- a content of the boron nitride powder in the composition is in a range of 80 to 90% by mass,
- a content of the fluororesin in the composition is in a range of 10 to 20% by mass,
- the fluororesin further contains a fusible fluororesin, and
- a content of the fusible fluororesin in the fluororesin is in a range of 5 to 50% by mass.
5 more elements
Dependencies are inferred from the claim text.