Heat sink for LED light source
AssigneeUltravision Technologies, LLC
InventorDavid Siucheong Auyeung
Life of this patent
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Abstract
A back panel for use in a light emitting diode (LED) lighting assembly is disclosed. An extruded substrate formed of a thermally conductive material is provided, the substrate having a plurality of fins extending from a first side of the substrate, each of the fins having a substantially rectangular shape oriented so that a longitudinal axis of the fin is substantially parallel to a longitudinal axis of the substrate. At least some of the fins include a hole formed through the fin to enable heated air to rise through the fins. A plurality of LEDs are mounted on a second side of the substrate, and oriented in a longitudinal orientation with the fins oriented parallel to the bottom edge of a surface to be illuminated, such that heat rises perpendicular to the surface of the fin.
Claims29
A back panel of a light emitting diode (LED) lighting assembly comprising:
- a heat sink comprising a thermally conductive substrate, the thermally conductive substrate comprising a first major surface and an opposite second major surface, wherein the first major surface has a first edge along a first direction and a second edge along a second direction perpendicular to the first direction, wherein the heat sink is configured to support a LED panel and an optics panel over the first major surface along a third direction perpendicular to the first and the second directions;
- a plurality of fins extending away from the second major surface and disposed on the thermally conductive substrate, wherein the plurality of fins comprise a first fin, a second fin, and a third fin, wherein the first fin and the second fin comprise a length along the first direction longer than a width along the second direction, wherein the first fin is parallel to the second fin, and wherein the second fin is oriented at a first angle to the third fin;
- and
- a groove on the second major surface, wherein the groove is spaced away from the plurality of fins along the second direction, wherein the thermally conductive substrate is thinner at the groove than at a location directly below the plurality of fins, and wherein the groove is configured to receive a mounting plate.
A back panel of a light emitting diode (LED) lighting assembly comprising:
- a heat sink comprising a thermally conductive substrate, the thermally conductive substrate comprising a first major surface and an opposite second major surface, wherein the first major surface has a first edge along a first direction and a second edge along a second direction perpendicular to the first direction, wherein the heat sink is configured to support a LED panel and an optics panel over the first major surface along a third direction perpendicular to the first and the second directions;
- a plurality of fins extending away from the second major surface and disposed on the thermally conductive substrate, wherein the plurality of fins comprise air openings, wherein the plurality of fins comprise a first fin, a second fin, a third fin, a fourth fin, and a fifth fin, wherein the first fin and the second fin comprise a length along the first direction longer than a width along the second direction, wherein the first fin is parallel to the second fin, wherein the second fin is oriented at a first angle to the third fin, wherein the fourth fin is oriented at a second angle to the third fin, wherein the first angle is different from the second angle, wherein the fifth fin is oriented at a third angle to the third fin, and wherein the first angle is different from the second angle and the third angle;
- and
- a groove on the second major surface, wherein the groove is spaced away from the plurality of fins along the second direction, wherein the thermally conductive substrate is thinner at the groove than at a location directly below the plurality of fins, and wherein the groove is configured to receive a mounting plate.
A support structure of a light emitting diode (LED) lighting assembly comprising:
- a heat sink comprising a thermally conductive substrate, the thermally conductive substrate comprising a first major surface and an opposite second major surface, wherein the first major surface has a first edge along a first direction and a second edge along a second direction perpendicular to the first direction, wherein the heat sink is configured to support a LED panel and an optics panel over the first major surface along a third direction perpendicular to the first and the second directions;
- a plurality of fins extending away from the second major surface and disposed on the thermally conductive substrate, wherein the plurality of fins comprise a first fin, a second fin, and a third fin, wherein the first fin and the second fin comprise a length along the first direction longer than a width along the second direction, wherein the first fin is parallel to the second fin, and wherein the second fin is oriented at a first angle to the third fin;
- a power supply enclosure mounted over the heat sink;
- and
- a groove on the second major surface, wherein the groove is spaced away from the plurality of fins along the second direction, wherein the thermally conductive substrate is thinner at the groove than at a location directly below the plurality of fins, and wherein the groove is configured to receive a mounting plate.
Dependencies are inferred from the claim text.