Manufacturing method and manufacturing apparatus of semiconductor substrate

A manufacturing apparatus of a semiconductor substrate comprising:

• a substrate supporting base comprising a plurality of substrate arrangement regions, the plurality of substrate arrangement regions each configured to be provided with a first substrate having corner portions;
• a plurality of openings in each of the plurality of substrate arrangement regions;
• a plurality of lift pins in the plurality of openings;
• and
• a plurality of raising and lowering mechanisms configured to raise and lower the plurality of lift pins, the plurality of raising and lowering mechanisms being configured to press the first substrate to a second substrate so that the first substrate is bonded to the second substrate,
• wherein the plurality of lift pins is configured to bring one of the corner portions of the first substrate into contact with the second substrate, when the first substrate and the second substrate are bonded to each other.